In an industrial environment that pursues high - performance materials, proper handling of heat dissipation and bonding is of utmost importance. The IOTA 69320 condensation one - component thermal conductive bonding material, with its outstanding performance, has become an ideal solution to these challenges. The IOTA 69320 has many remarkable characteristics. As a one - component neutral alcohol - releasing material, it has a high thermal conductivity of 2.0 W/(m·K), which can efficiently transfer heat and provide high - quality heat dissipation protection for various heat - generating components. It adopts a moisture - curing mechanism and is in a paste state, which is convenient for construction operations. As an organic silicon thermal conductive bonding adhesive, its stability and reliability are fully guaranteed. From the perspective of technical indicators, it appears as a white paste with a uniform appearance. The density is 2.75 g/cm³, ensuring the compactness of the material. The surface - drying time is only 6 - 12 minutes, which greatly improves work efficiency. The hardness is shore 75±5, with good mechanical strength. The actual thermal conductivity reaches 2.03 W/(m·k), slightly higher than the nominal value, resulting in more excellent heat dissipation performance. It is of the formic - acid - releasing type and is catalyzed by titanium, which further ensures the stable performance of the product. In the application field, the IOTA 69320 has a wide range of uses. When used for the sealing of LED lamps, it can not only effectively block external impurities and moisture but also help the lamps dissipate heat, thus extending their service life. In terms of heat dissipation of automotive electronic components, it can quickly transfer heat to ensure the stable operation of electronic devices under complex working conditions. For the heat dissipation, positioning, and sealing of PCB boards and electronic components, it can achieve the dual functions of accurate positioning and efficient heat dissipation. When filling the gaps between high - power triodes and thyristor - element diodes and substrates (aluminum, copper), it can closely adhere and fill the gaps, improving the heat dissipation effect and connection stability. With its reliable performance, the IOTA 69320 provides solid support for the heat dissipation and bonding needs of various industries.
IOTA 69320 condensation one-component thermally conductive adhesive material-Silicone Adhesive