Application:

(I) Electronic and Electrical Field

In the manufacturing of electronic devices, such as the connection between the CPU and the heat sink, and the packaging of LED lamps, the condensation-type one-component silicone thermal conductive adhesive can simultaneously achieve the dual functions of heat conduction and bonding. It not only ensures the efficient heat dissipation of electronic components but also guarantees the electrical insulation performance between components, improving the overall reliability and stability of electronic devices.

(II) Automotive Manufacturing Industry

Components such as automotive engines and transmissions generate a large amount of heat during operation. This adhesive can be used for the bonding of heat sinks and the fixation of sensors for these components. Its good oil resistance, high temperature resistance, and reliable bonding strength can meet the usage requirements of automobiles under complex working conditions and ensure the safe operation of automobiles.

(III) Aerospace Field

Aerospace equipment has extremely strict requirements for material performance. The condensation-type one-component silicone thermal conductive adhesive, with its excellent thermal stability, lightweight advantage, and reliability in extreme environments, is widely used in the installation of electronic equipment and the bonding of structural components of aircraft. It provides strong support for the high-performance operation of aerospace equipment.

Preparation Process 

(I) Storage and Usage Conditions

This adhesive usually needs to be stored in a low-temperature and dry environment to ensure its long storage period. When using it, attention should be paid to the ambient temperature and humidity. Generally, it is recommended to operate under the conditions of 20 - 25°C and a relative humidity of 40% - 60% to obtain the best bonding effect.

(II) Surface Treatment

The cleanliness and roughness of the adherend surface have an important impact on the bonding effect. Before applying the adhesive, the adherend surface needs to be cleaned by degreasing, dust removal, etc., and the surface roughness can be increased by sanding and other methods to improve the adhesion of the adhesive.

(III) Adhesive Application and Curing

The condensation-type one-component silicone thermal conductive adhesive is generally applied by methods such as dispensing and brushing. After coating, the adhesive undergoes a curing reaction by absorbing moisture in the air. The curing time usually varies according to environmental conditions and the thickness of the adhesive layer. Generally, it takes several hours to dozens of hours to fully cure at room temperature. Appropriately increasing the temperature can accelerate the curing speed, but attention should be paid to controlling the temperature range to avoid adverse effects on the performance of the adhesive. The condensation-type one-component silicone thermal conductive adhesive, with its unique chemical structure and outstanding performance, shows great application potential in numerous industries. With the continuous progress of science and technology and the continuous optimization of processes, it will play a key role in more fields and inject new vitality into the development of modern industry.