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IOTA H21500 Polycarbosilane-based Adhesive: An Outstanding Choice in the High-temperature Resistance Field

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In numerous industrial scenarios with strict requirements for material performance, the IOTA H21500 polycarbosilane-based adhesive has become an ideal solution to solve the problems of high-temperature bonding and sealing due to its outstanding characteristics.
The IOTA H21500 has the advantage of medium-temperature curing and a short curing time, which greatly improves production efficiency and reduces the time cost of waiting for the adhesive to cure, providing strong support for fast-paced production processes. Its temperature resistance performance is extremely excellent, capable of withstanding high-temperature environments exceeding 1500°C. Under extreme high-temperature working conditions, it can still maintain stable performance, ensuring the normal operation of the bonded and sealed components.
This adhesive is a gray two-component polycarbosilane-based product and is solvent-free. This not only makes its use safer and more environmentally friendly but also avoids the problem of performance instability caused by solvent residues. It has a wide range of applications and can easily achieve the bonding and sealing between metals, ceramics, or composite materials. Whether it is the connection of metal and ceramic components in the aerospace field or the sealing of composite materials in industrial manufacturing, it can demonstrate excellent bonding effects. At the same time, it can also be used to prepare high-temperature resistant coating materials, providing reliable protection for various materials vulnerable to high temperatures.
In terms of technical parameters, it has a gray appearance and a viscosity ranging from 3000 to 4000cp, with good fluidity, which is convenient for uniform application and construction. In terms of performance, when used for bonding graphite materials, the bonding strength at room temperature is greater than 10MP. The compression-shear strength is greater than 15MPa at 500°C and 900°C, greater than 12MPa at 1100°C, and still greater than 10MPa at 1400°C, demonstrating strong high-temperature bonding performance. Its curing condition is to cure at 220°C for 2 hours.
In terms of packaging, according to customers' needs, plastic drums with a capacity of 0.5L to 10L can be used for packaging, flexibly meeting the requirements of different usage amounts. When storing, place the sealant in a cool and dry place, and the shelf life can reach 1 year. The IOTA H21500 polycarbosilane-based adhesive provides a solid guarantee for applications in the high-temperature field with its reliable performance and is the best choice for those who pursue high-quality bonding and sealing effects.
IOTA H21500 Polycarbosilane adhesive-Silicone Adhesive

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