Curing Pressure:

• It is beneficial for the adhesive to fully wet the surface.
• It helps to expel the low-molecular volatile substances generated during the curing reaction of the adhesive.
• It is conducive to removing the residual volatile solvents in the adhesive layer.
• It is helpful for controlling the thickness of the adhesive layer. Adhesives with high viscosity usually result in a thicker adhesive layer, and adjusting the curing pressure can control the thickness range of the adhesive layer.

After applying the adhesive, let it stand for a period of time, which is called pre-curing. When the viscosity of the adhesive liquid increases, apply pressure to ensure the uniformity of the thickness of the adhesive layer.
Curing Temperature:

• If the curing temperature is too low, the cross-linking density of the adhesive layer will be too low, and the curing reaction will be incomplete.
• If the curing temperature is too high, it is likely to cause the adhesive liquid to flow away or make the adhesive layer brittle, resulting in a decrease in the bonding strength.
• Heating is beneficial for the molecular diffusion between the adhesive and the bonded parts, and it can contribute to the formation of chemical bonds.

(1) Direct Oven Heating Method: Use a blast device to ensure uniform heat transfer.
(2) External Heating Method: Make the heat quickly reach the inside of the adhesive layer, greatly shortening the curing time.

• Sonic Wave Heating Method: It is suitable for the heat curing of viscoelastic adhesives and solvent-free adhesive liquids, but not suitable for thermosetting rigid adhesives
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