IV. Considerations When Selecting Potting Materials
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Requirements for Post - Potting Performance:
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Operating temperature, conditions of thermal cycling, the internal stress that components can withstand, whether it is for outdoor or indoor use, stress - bearing conditions, requirements for flame - retardancy and heat - conductivity, color requirements, etc.
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Potting Process:
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Manual or automatic operation, curing at room temperature or with heating, total curing time, setting time of the mixed glue, etc.
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Cost:
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The specific gravity of potting materials varies greatly. We must consider the actual cost after potting, rather than simply looking at the selling price of the material.
Adhesives used for potting can be classified by function into heat - conductive potting adhesives, bonding potting adhesives, and waterproof potting adhesives. By material, they can be divided into polyurethane potting adhesives, silicone potting adhesives, and epoxy resin potting adhesives. When it comes to choosing between soft glue and hard glue, both can be used for potting, waterproofing, and insulating. If high - temperature and heat - conductive properties are required, it is recommended to use silicone soft glue. If low - temperature resistance is needed, polyurethane soft glue is a better choice. If there are no specific requirements, epoxy hard glue is advisable because it cures faster than silicone.
Epoxy resin potting adhesives have a wide range of applications. The technical requirements vary greatly, and there are numerous varieties.
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Classification by Curing Conditions: There are two types: room - temperature curing and heat - curing.
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Classification by Dosage Form: There are two - component and one - component types. Room - temperature curing epoxy potting adhesives are generally two - component. Its advantage is that it can cure without heating after potting, has low requirements for equipment, and is easy to use. However, it has some drawbacks. The working viscosity of the glue mixture is high, the infiltration property is poor, the pot life is short, and the heat - resistance and electrical properties of the cured product are not very high. It is generally used for potting low - voltage electronic components or in situations where heat - curing is not suitable.
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Products-IOTA
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