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A New Breakthrough in Industrial Bonding

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In the field of industrial manufacturing, the performance of adhesive materials is directly related to the quality, stability, and service life of products. IOTA 69550 addition - type one - component thermally conductive adhesive offers a new solution to industrial bonding challenges with its outstanding characteristics and excellent performance, making it an ideal choice for numerous enterprises in industries such as electronics and automotive.

IOTA 69550 has several unique product features. It has strong process adaptability, supporting both stencil printing and precise dispensing, which meets the glue - applying requirements in different production scenarios and greatly improves production flexibility and efficiency. It features a low BLT, effectively ensuring the stability of the product during use. Its bonding performance is particularly excellent, enabling it to firmly connect various materials. Rapid curing is one of its major highlights. It can complete curing and form a reliable bond in just 30 minutes at 150°C, significantly shortening the production cycle and enhancing production efficiency. Moreover, its low thermal resistance change rate ensures stable heat conduction under different working conditions, guaranteeing the normal operation of equipment. In addition, the flexibility of the material allows it to adapt to surfaces of different shapes and materials. While providing strong adhesion, it can effectively buffer stress, preventing cracking or debonding caused by factors such as thermal expansion and contraction of materials.


In terms of technical specifications, IOTA 69550 also performs remarkably. Its thermal conductivity is as high as 2.2 W/m·K, enabling efficient heat conduction and providing a strong guarantee for the heat dissipation of heat - generating components. The material is in a semi - thixotropic fluid state, facilitating operation and glue - applying. Its density is 2.65 g/cm³, ensuring the stability and reliability of the material. The curing time is 30 minutes at 150°C. This rapid - curing feature not only improves production efficiency but also does not affect its final performance. The hardness is shore A 75 ± 10, ensuring both a certain strength and flexibility. The shear strength (MPa, Al/Al) reaches 3.2, fully demonstrating its strong bonding ability.


IOTA 69550 has a wide range of application fields. In the automotive electronics industry, it can be used for bonding the plastic shells of automotive electronic devices to aluminum plates, ensuring the stable operation of electronic devices in the complex automotive operating environment. In the manufacturing of electronic equipment, it plays a crucial role in the thermally conductive bonding and fixation of heat - generating components or MOS tubes, effectively solving heat - dissipation and fixation problems. In semiconductor manufacturing, it can be used for the bonding of heating elements and the fixation of wafers, ensuring the normal operation of precision components such as chips. In addition, it can also perform outstandingly in the bonding and sealing of various types of casings, providing reliable sealing and bonding effects.


With the growing demand for high - performance adhesive materials in industrial manufacturing, IOTA 69550 addition - type one - component thermally conductive adhesive, with its excellent characteristics, remarkable technical specifications, and wide application fields, is gradually becoming a favorite in the industrial bonding field, contributing to the technological progress and product upgrading of various industries.

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