Organosilicon thermal conductive adhesive materials possess numerous advantages as follows:
 I. Excellent Thermal Conductivity
1. High-Efficiency Heat Dissipation
- Organosilicon thermal conductive adhesive materials can effectively increase the thermal conductivity coefficient by reasonably combining thermal conductive fillers such as aluminum oxide and boron nitride. Compared with traditional adhesive materials, its thermal conductivity has achieved a qualitative leap. In high-power electronic equipment, it acts like a "heat expressway", enabling heat to be quickly conducted away from heat sources (such as CPUs, power chips, etc.), so that the internal temperature of the equipment can be maintained within a reasonable range. For example, in the application of heat dissipation for smartphone processors, this material closely adheres to the chip and the heat dissipation module and can rapidly export the large amount of heat generated during the operation of the processor, avoiding phenomena such as freezes and crashes of the mobile phone caused by overheating and ensuring a smooth user experience.
- Researchers adopt a multi-component composite filler system and blend metal oxides and nitrides with high thermal conductivity in specific proportions according to the thermal conductivity characteristics of different materials. This precise formulation creates exclusive and efficient channels for heat conduction, allowing the heat flow to spread rapidly and unimpeded inside the material, greatly reducing the thermal resistance and ensuring the stable operation of the equipment.
 II. Good Temperature Resistance
1. Stable Operation in a Wide Temperature Range
- The main chain structure of organosilicon is stable. It is closely connected by silicon-oxygen bonds, and this unique chemical structure endows the material with excellent temperature resistance. Generally, it can work stably in a temperature range from -50 °C to 200 °C or even wider. In extreme temperature environments, such as in the aerospace field, when an aircraft is in the high altitude, the external environmental temperature is extremely low, while its internal electronic equipment will generate high temperature when operating at full load, and the temperature fluctuations in the electronic cabin are drastic. Organosilicon thermal conductive adhesive materials are like loyal guards in such an environment. They can not only ensure that the bonding between various components is firm and will not become loose due to sudden temperature changes but also conduct heat efficiently, timely eliminating potential heat hazards that may threaten flight safety and safeguarding space exploration, intercontinental flights and other flight missions.
III. Outstanding Chemical Stability
1. Strong Corrosion Resistance
- In harsh environments such as chemical production, there are a large number of acidic and alkaline substances and organic solvents. Organosilicon thermal conductive adhesive materials are like warriors wearing strong armor, showing super resistance to common acids, alkalis and organic solvents. Whether it is the leakage of strongly acidic chemical raw materials, the accidental splash of alkaline solutions, or long-term exposure to industrial waste gas containing organic solvents, it will not easily undergo chemical reactions that lead to performance degradation.
- This chemical stability enables it to serve reliably for a long time in many fields such as the chemical industry, marine, and outdoor power facilities. For example, in applications such as the sealing of chemical pipelines, the bonding of heat conduction components, the protective bonding of electronic equipment on offshore platforms, and the connection of transformers on outdoor utility poles, it can effectively reduce equipment damage caused by chemical corrosion and greatly reduce maintenance costs and equipment replacement frequencies.
 IV. Excellent Flexibility
1. Buffering Stress to Protect the Bonding Interface
- In practical applications, due to significant environmental temperature changes caused by the alternation of day and night and the change of seasons, or the thermal expansion and contraction phenomena caused by the self-heating and cooling cycles of equipment operation, stress will inevitably be generated. With its flexibility, organosilicon thermal conductive adhesive materials are like agile dancers and can gently buffer these stresses.
- Taking the bonding of solar photovoltaic panel components as an example, photovoltaic panels work outdoors, and the temperature changes across the four seasons are extremely large, from bitterly cold winter mornings to scorching summer afternoons. During this process, organosilicon thermal conductive adhesive materials always protect the components with their flexibility, effectively avoiding disastrous consequences such as cracking at the bonding interface caused by stress concentration, ensuring the integrity of the photovoltaic panel components, enabling them to continuously and efficiently convert solar energy into electrical energy and contributing to the green energy cause.