Adhesive solutions for new energy automobile industry (2)
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4. Thermal conductivity and heat dissipation of the electrically controlled heating parts of the motor. Plaitone has two types of thermal conductive gel products, one-component thermal gel and two-component thermal caulking agent. They have good adhesion properties and can be repaired and disassembled. After curing, device assembly tolerances are eliminated, effectively reducing stress damage to components. It can automate glue dispensing construction, making production and construction convenient and efficient. It is widely used in thermal conduction, sealing and caulking protection in motor electronic control, power supply, electronic communications, charging piles and other fields.
Product features: low density, high thermal conductivity, up to 10w/mk, good thermal shock resistance and mechanical vibration resistance, low stress, high ductility, good insulation properties, flame retardant properties.
5. Motor electronic control DC-DC, OBC and inverter power supply thermal conductive potting glue can be cured in the greenhouse and can be accelerated by heating. It has good fluidity and is easy to fill gaps between electronic components. The operating time and curing speed can be adjusted, adapting to the machine's fully automatic, semi-automatic, and manual potting processes. After curing, the potted products are moisture-proof, waterproof, dust-proof, shock-proof, and insulated to extend the service life of the power supply. It can be used for thermal conductive encapsulation of various complex components such as motor electronic control DC-DC, OBC and inverter power supply.
Product features: No solvents or by-products, minimal shrinkage, low specific gravity, good adhesion properties, flame retardant properties and high thermal conductivity, good flow properties and resistance to cold and heat shock.
6. Thermal conductive potting for charging piles. The thermally conductive potting glue for charging piles is a two-component addition type thermally conductive potting glue. After components A and B are mixed at a weight ratio of 1:1, it can be cured in a greenhouse and can be accelerated by heating. . It has good fluidity and is easy to fill gaps between electronic components. Suitable for fully automatic, semi-automatic and manual potting processes. After curing, the potted product has excellent adhesion to the base material, achieving moisture-proof, waterproof, dust-proof, shock-proof and insulation. It can be used for thermal conductive potting of various complex components such as charging piles.
Product features: No solvents or by-products, minimal shrinkage, good adhesion properties, flame retardant properties and high thermal conductivity, good flow properties and resistance to cold and thermal shock.