High temperature resistant adhesives usually refer to adhesives that can be used at temperatures above 150°C. This type of adhesive mainly includes modified multifunctional epoxy resins (EP), phenolic resins, silicon (or boron) polymers, aromatic heterocyclic high temperature resistant polymers and inorganic adhesives.
PI adhesives are the earliest developed, most widely used and best comprehensive high temperature resistant structural adhesives. After curing at 300°C, they have good heat resistance and shear strength at 300°C to 400°C. They can be used for a long time at 230°C and withstand high temperatures of 550°C for a short time. They have good low temperature resistance, solvent resistance, wear resistance, flame retardancy and extremely low thermal expansion coefficient. The polyetheretherketoneimide adhesive developed by Jilin University has a shear strength of more than 13MPa at room temperature and 150°C.
Bismaleimide (BMI) is a type of cross-linked PI with excellent performance, which combines the excellent high temperature resistance and moisture resistance of PI. When BMI is introduced into epoxy resin, due to the different polymerization mechanisms and compatibility of the two, an interpenetrating network structure or a two-phase system may be formed during the polymerization process, thereby achieving the purpose of toughening and improving heat resistance. Cyanate-modified BMI adhesive can work for a long time at 230°C with a shear strength of more than 13MPa. The adhesive J-223 for high-temperature radomes can be cured at 100°C, and the shear strength is 0.5MPa at 500°C.
silicone adhesive products are as follows:
Products-IOTA (siliconeadhesives.net)