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some methods to make up for the shortcomings of room-temperature-curing epoxy adhesives(1)

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I. Methods to make up for the relatively limited performance
 1.Formula improvement
(1)Adding heat-resistant fillers:
Some fillers with good heat resistance, such as ceramic micro-powder and mica powder, can be added to the adhesive formula. These fillers can improve the thermal stability of the adhesive and enhance its performance in high-temperature environments to some extent. For example, ceramic micro-powder has a relatively high melting point and thermal conductivity. After being added to the adhesive, it can absorb and disperse heat, reducing the softening degree of the adhesive layer at high temperatures and thus improving the heat resistance of the adhesive. 
(2)Modifying with high-performance resins:
High-performance epoxy resins or other resins can be used to modify room-temperature-curing epoxy adhesives. For instance, introducing phenolic resin can improve the thermal and mechanical properties of the adhesive. Phenolic resin has a relatively high cross-linking density and thermal stability. When mixed with epoxy adhesives, it can form a more stable three-dimensional network structure, enhancing the heat resistance and chemical resistance of the adhesive. 
(3)Optimizing the curing agent system:
Selecting appropriate curing agents or combinations of curing agents can improve the performance of the adhesive. Some new latent curing agents can remain stable at room temperature but can carry out the curing reaction more effectively under specific conditions such as heating, forming a denser cross-linking structure and improving the thermal resistance performance of the adhesive.

2.Multi-layer structure design In application scenarios with high requirements for high-temperature tolerance, a multi-layer bonding structure can be adopted. For example, when bonding high-temperature engine components, the room-temperature-curing epoxy adhesive can be used as the bottom layer first to provide basic bonding strength and filling function. Then, a high-temperature-resistant adhesive, such as high-temperature-curing silicone adhesive, can be coated on its surface. In this way, the advantages of both adhesives can be utilized, ensuring the convenience of operation at room temperature and meeting the performance requirements in high-temperature environments.

 3.Surface treatment
Appropriate pretreatment can be carried out on the surface of the adherends. For example, methods such as electroless plating and anodizing can be used to form a coating with good heat resistance and adhesion on the surface of the adherends. For instance, after anodizing the metal surface, a dense oxide film will be generated on the surface. This oxide film can enhance the bonding force between the adhesive and the metal surface, and the oxide film itself also has a certain degree of heat resistance, indirectly improving the stability of the bonded structure at high temperatures. 

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